ASICLAND

Project Enabling(PE)
- Project Schedule Management
  from Kick-off to Sign-off
- ASIC Design Service
IP survey
- IP survey based on Customer Design
  Specification
- Development of Customized IP
  according to Customer needs
TSMC Technical Support
- Support Customer's Technical
  requirement
- Support PDK (Process Design Kit)
  Management
- Support Customer's Tape-Out
Package(PKG) Service
- Support Customer Package Design
- Package Schedule Management
- Wafer bumpy service
  (solder / cup Bump)
Test Service
- Wafer level Circuit Probing(CP) and
  Package level Final Test (FT)
- Run the testing program with qualified
  test house
Failure Analysis &
Reliability Service
- Support FA solutions for RMA
  and Defect identification
- Support reliability qualification
  services

为回应客户的宝贵产品，ASICLAND提供芯片制作流程的全面服务。

我们将根据客户应用的多种需求，提供针对性的封装类型和技术服务。

ASICLAND将根据客户的产品，提供针对性的晶圆和封装测试方案。
- 根据产品的特征、测试费用和数量，选定ATE平台
- 制作Probe card、Load board、Socket等测试硬件
- 测试项目的开发及优化
为快速实现量产，与主要ATE供应商和Test House建立合作关系，从而满足客户的需求。