ASICLAND

Project Enabling(PE)
- Project Schedule Management
  from Kick-off to Sign-off
- ASIC Design Service
IP survey
- IP survey based on Customer Design
  Specification
- Development of Customized IP
  according to Customer needs
TSMC Technical Support
- Support Customer's Technical
  requirement
- Support PDK (Process Design Kit)
  Management
- Support Customer's Tape-Out
Package(PKG) Service
- Support Customer Package Design
- Package Schedule Management
- Wafer bumpy service
  (solder / cup Bump)
Test Service
- Wafer level Circuit Probing(CP) and
  Package level Final Test (FT)
- Run the testing program with qualified
  test house
Failure Analysis &
Reliability Service
- Support FA solutions for RMA
  and Defect identification
- Support reliability qualification
  services

ASICLAND為了客戶方的重要產品，提供晶片製作的整體服務流程。

我們將根據客戶應用的各種需求，提供針對性的包裝類型及技術服務。

ASICLAND將根據客戶的產品，提供針對性的晶圓和封裝測試方案。
- 選定考慮到產品特性、測試費用與數量的ATE平台
- 製作Probe card、Load board、Socket等測試的硬體
- 開發測試程序與優化
爲了建立迅速且穩定的量產作業，主要與ATE供應商、測試室建立合作關係，應對客戶之要求。